Temescal UEFC-4900 Deposition System with Auratus

$ P.O.A.

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Temescal UEFC-4900 Deposition System with Auratus

Ultimate Uniformity in Lift-Off Processes, Optimized for 150mm Wafers

The Temescal UEFC-4900 Deposition System with Auratus is the compact version of the UEFC-5700. It represents the ultimate mid-sized coater for lift-off processes. The source-to-substrate distance and chamber angles in the UEFC-4900 have been optimized for 150mm wafers and the system supports 25 x 150mm wafers.

The load locked product chamber is pumped by a CTI model CT-500 cryogenic pump. Powerful cryopumps make it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

Key Features:

  • Large capacity: 25 x 150mm
  • 40% more wafers with no increase in footprint or power consumption
  • Less than 15 minutes to 5E-07 Torr
  • 36,500 L/sec pumping
  • Significantly less surface area and volume


  • Ultimate Uniformity Production: 150mm
  • Product Chamber Type: conic
  • Load Lock to isolate Product Chamber
  • Cryopump water L/sec: 36,500
  • Pump down time: 1E-06 < 10mins
  • E-gun (max pkg): 2 6x25cc PopTops + 1 fixed pocket
  • E-gun Power Supply: 6, 12, or 15 kW
  • Ion gun: MKII HC
  • Max wafer count: Lift off 25x150mm
  • Source to Substrate: std 35.5”

System Control

  • Temescal Control System (TCS), with Auto, Manual modes plus process datalogging
  • Security code-based access for multiple classes of users
  • TCS-based process variable monitoring (PVM), allowing user to set tolerance alarms for critical process variables
  • 17″ high resolution color touch screen interface


  • Temescal 4- or 6-pocket Standard or PopTop turret source
  • Temescal model CV-6SLX or CV-12SLX e-beam power supply (Simba option available)
  • TemEBeam Contoller: Sweep, Index, Gun & HV


  • HULA: High Uniformity Lift-off Assembly
  • Lift-off dome or dome frame with segments
  • Flip tooling: allows for two sided or edge coating
  • VAP: Variable Angle Planetary

Vacuum Pumping & Control

  • Market leading dry roughing pump >60 cfm (102 m3/h)
  • CTI On-Board Cryopumps
  • Cryopump temperature monitoring
  • Active Inverted Magnetron gauges and Pirani controllers, monitored and controlled by the TCS

Product Chamber

  • Dimensions in inches: 49 conic
  • Product chamber cryopump: CT-500 30,000 L/Sec
  • Water cooled product chamber walls
  • Two sets of product chamber evaporation shields
  • Wide-angle viewport on front of system
  • Maskless uniformity
  • Spare port(s) for RGA or alternate access
  • 10” and 12.75” diameter side ports for optional components

Source Chamber

  • Source-isolation valve allows product chamber access while source chamber remains under vacuum
  • Source chamber cryopump: CT-10 9,000 L/Sec
  • Source Tray Dimensions in inches: 20
  • Drop-down, swing-out source tray, accessible from either clean room or chase side of vacuum cubicle
  • Wide-angle 4” viewport
  • Removable stainless-steel source shields

Water & Air System

  • Stainless steel manifold provides cooling water for source and product chamber components
  • Separate product chamber circuit for cold and optional hot water
  • TCS-controlled auto-blowdown for turret source
  • PLC-controlled air manifold

System Wide

  • 3 EMO switches
  • Standard 19” wide electronics rack on casters
  • Surfaces exposed to high vacuum are made of 304 SST

Temescal Control System

The Temescal Control System (TCS) provides fully integrated, recipe-driven process and vacuum control. Operating in any of three password-protected modes, the TCS also offers process variable monitoring, process and historical trend tracking, and process data logging.

Contact us for more information.

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