Temescal UEFC-4900 Deposition System with Auratus
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Temescal UEFC-4900 Deposition System with Auratus
Ultimate Uniformity in Lift-Off Processes, Optimized for 150mm Wafers
The Temescal UEFC-4900 Deposition System with Auratus is the compact version of the UEFC-5700. It represents the ultimate mid-sized coater for lift-off processes. The source-to-substrate distance and chamber angles in the UEFC-4900 have been optimized for 150mm wafers and the system supports 25 x 150mm wafers.
The load locked product chamber is pumped by a CTI model CT-500 cryogenic pump. Powerful cryopumps make it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.
Key Features:
- Large capacity: 25 x 150mm
- 40% more wafers with no increase in footprint or power consumption
- Less than 15 minutes to 5E-07 Torr
- 36,500 L/sec pumping
- Significantly less surface area and volume
System
- Ultimate Uniformity Production: 150mm
- Product Chamber Type: conic
- Load Lock to isolate Product Chamber
- Cryopump water L/sec: 36,500
- Pump down time: 1E-06 < 10mins
- E-gun (max pkg): 2 6x25cc PopTops + 1 fixed pocket
- E-gun Power Supply: 6, 12, or 15 kW
- Ion gun: MKII HC
- Max wafer count: Lift off 25x150mm
- Source to Substrate: std 35.5”
System Control
- Temescal Control System (TCS), with Auto, Manual modes plus process datalogging
- Security code-based access for multiple classes of users
- TCS-based process variable monitoring (PVM), allowing user to set tolerance alarms for critical process variables
- 17″ high resolution color touch screen interface
E-Beam
- Temescal 4- or 6-pocket Standard or PopTop turret source
- Temescal model CV-6SLX or CV-12SLX e-beam power supply (Simba option available)
- TemEBeam Contoller: Sweep, Index, Gun & HV
Substrate
- HULA: High Uniformity Lift-off Assembly
- Lift-off dome or dome frame with segments
- Flip tooling: allows for two sided or edge coating
- VAP: Variable Angle Planetary
Vacuum Pumping & Control
- Market leading dry roughing pump >60 cfm (102 m3/h)
- CTI On-Board Cryopumps
- Cryopump temperature monitoring
- Active Inverted Magnetron gauges and Pirani controllers, monitored and controlled by the TCS
Product Chamber
- Dimensions in inches: 49 conic
- Product chamber cryopump: CT-500 30,000 L/Sec
- Water cooled product chamber walls
- Two sets of product chamber evaporation shields
- Wide-angle viewport on front of system
- Maskless uniformity
- Spare port(s) for RGA or alternate access
- 10” and 12.75” diameter side ports for optional components
Source Chamber
- Source-isolation valve allows product chamber access while source chamber remains under vacuum
- Source chamber cryopump: CT-10 9,000 L/Sec
- Source Tray Dimensions in inches: 20
- Drop-down, swing-out source tray, accessible from either clean room or chase side of vacuum cubicle
- Wide-angle 4” viewport
- Removable stainless-steel source shields
Water & Air System
- Stainless steel manifold provides cooling water for source and product chamber components
- Separate product chamber circuit for cold and optional hot water
- TCS-controlled auto-blowdown for turret source
- PLC-controlled air manifold
System Wide
- 3 EMO switches
- Standard 19” wide electronics rack on casters
- Surfaces exposed to high vacuum are made of 304 SST
Temescal Control System
The Temescal Control System (TCS) provides fully integrated, recipe-driven process and vacuum control. Operating in any of three password-protected modes, the TCS also offers process variable monitoring, process and historical trend tracking, and process data logging.
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