Temescal UEFC-5700 Deposition System with Auratus
Please contact us for price & delivery time.
Temescal UEFC-5700 Deposition System with Auratus
Ultimate Throughtput in Lift-Off Processes with 150mm or 200mm Wafers
The Temescal UEFC-5700 Deposition System with Auratus represents our ultimate high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of forty-two 150mm wafers per load via high capacity e-beam evaporation.
The load locked product chamber can be pumped by as many as two dedicated, high throughput 16-inch cryogenic pumps. Dual-cryopumps make it possible to pump this large chamber in 10 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.
Key Features:
- Large capacity: 42 x 150mm
- 40% more wafers with no increase in footprint or power consumption
- Less than 10 minutes to 5E-07 Torr
- 44,000 L/sec pumping
- Significantly less surface area and volume
System
- Ultimate Uniformity Production: 150 & 200mm
- Product Chamber Type: conic
- Load Lock to isolate Product Chamber
- Cryopump water L/sec: 44,000
- Pump down time: 1E-06 < 10mins
- E-gun (max pkg): 2 6x25cc PopTops + 1 fixed pocket
- E-gun Power Supply: 6, 12, or 15 kW
- Ion gun: MKII HC
- Max wafer count: Lift off 42x150mm, 21x200mm
- Source to Substrate: std 43”
System Control
- Temescal Control System (TCS), with Auto, Manual modes plus process datalogging
- Security code-based access for multiple classes of users
- TCS-based process variable monitoring (PVM), allowing user to set tolerance alarms for critical process variables
- 17″ high resolution color touch screen interface
E-Beam
- Temescal 4- or 6-pocket Standard or PopTop turret source
- Temescal model CV-6SLX or CV-12SLX e-beam power supply (Simba option available)
- TemEBeam Contoller: Sweep, Index, Gun & HV
Substrate
- HULA: High Uniformity Lift-off Assembly
- Lift-off dome or dome frame with segments
- Flip tooling: allows for two sided or edge coating
- VAP: Variable Angle Planetary
Vacuum Pumping & Control
- Market leading dry roughing pump >60 cfm (102 m3/h)
- CTI On-Board Cryopumps
- Cryopump temperature monitoring
- Active Inverted Magnetron gauges and Pirani controllers, monitored and controlled by the TCS
Product Chamber
- Dimensions in inches: 57 conic
- Product chamber cryopump: Dual CT-400 35,000 L/Sec
- Water cooled product chamber walls
- Two sets of product chamber evaporation shields
- Wide-angle viewport on front of system
- Maskless uniformity
- Spare port(s) for RGA or alternate access
- 10” and 12.75” diameter side ports for optional components
Source Chamber
- Source-isolation valve allows product chamber access while source chamber remains under vacuum
- Source chamber cryopump: CT-10 (9,000 L/Sec)
- Source Tray Dimensions in inches: 25.5
- Drop-down, swing-out source tray, accessible from either clean room or chase side of vacuum cubicle
- Wide-angle 4” viewport
- Removable stainless-steel source shields
Water & Air System
- Stainless steel manifold provides cooling water for source and product chamber components
- Separate product chamber circuit for cold and optional hot water
- TCS-controlled auto-blowdown for turret source
- PLC-controlled air manifold
System Wide
- 3 EMO switches
- Standard 19” wide electronics rack on casters
- Surfaces exposed to high vacuum are made of 304 SST
Temescal Control System
The Temescal Control System (TCS) provides fully integrated, recipe-driven process and vacuum control. Operating in any of three password-protected modes, the TCS also offers process variable monitoring, process and historical trend tracking, and process data logging.
Contact us for more information.
Please enter your enquiry details below and we will get back shortly.
